MEMBERSHIP

The MMEC empowers members to discover new technologies, share capabilities, develop a skilled workforce, and bring groundbreaking innovation into scalable commercial production for the benefit of National Security. Membership is open to all agencies, academic institutions, research entities, non-profits and not-for-profits, private companies, state and local governments, federally funded research and development centers, or other legal entities.

Benefits of membership include:

  • Access government and DoD funded projects to advance technologies, products and solutions for a secure domestic supply chain
  • Obtain visibility into government needs and priorities
  • Collaborate with leaders in industry, academia, and government to support long term DoD military platforms and next-generation commercial applications
  • Identify partnership and teaming opportunities to advance business goals
  • Access Hub and Core fabrication facilities, infrastructure investments, and tools.
  • Provide input and shape the direction of future US microelectronics development through stakeholder, steering, and working group participation
  • Access equitable intellectual property policies and support for IP protection
  • Utilize workforce development efforts to create and access the next generation of microelectronics professionals
  • Access to strategic and aligned private capital from domestic sources to ensure both business growth and project success.

STEPS TO BECOME A MEMBER

Step 1: Complete Membership Application Below

Step 2. Download, Sign and Upload Mutual Non-Disclosure Agreement

Step.3. Download, Sign and Upload MMEC Membership Welcome Packet and Membership Agreement.

Step 4: On or around the week of October 1, you will be provided Membership Portal access subject to passing company security check.

MEMBERSHIP TYPE

COST

Open Membership

$0

Stakeholders, Federal, State, and Local Government, FFRDC’s

$0

Start-ups, R3 Universities, Community, Trade and Technical Colleges

$250

Small Business and R2 Universities

$500

Large Businesses and R1 Universities

$1,000

Membership application

Organization Address
Primary Member Contact(Required)
Technical Contact(Required)

Organizational Type

Please select the description(s) that apply to your organization. If “Other” please describe your company type in the space provided. Only organizations/individuals that have direct applications to ESC will be granted membership.

Organizational Type(Required)
*Haven’t performed any DoD or federal contract work in the past year
Technical Areas of Expertise
What is a non-traditional defense contractor? An entity that is not currently performing and has not performed, for at least the one-year period preceding the solicitation of sources by the Department of Defense for the procurement or transaction, any contract or subcontract for the Department of Defense that is subject to full coverage under the cost accounting standards (CAS). Review 48 CFR § 9903.201-1 for a list of CAS exemption
Organization Size (non-government)(Required)
Hidden
Consent(Required)
This field is for validation purposes and should be left unchanged.

MMEC Member Agreement

The MMEC Member Agreement outlines the membership model, structure, member participation, consortium project submittals, bylaws, dues, and policies. All memberships must be through affiliation with a US-based entity. Download the MMEC Member Agreement below and upload when completed. Welcome to the MMEC!

MUTUAL NON-DISCLOSURE AGREEMENT

As a MMEC member it is required that a, Mutual Nondisclosure Agreement (MNDA) MNDA between the MMEC and your organization and all project performers is in place BEFORE a project can be submitted to the government. The MMEC MNDA is available for download provided in the “DOWNLOAD MNDA” link below. Please review, sign the MNDA and upload to the link “UPLOAD NDA”.

CURRENT MEMBERS

3dGS
35elements Corp
Aaceses Ihmire Industries
Advanced Printed Electronic Solutions
AdvR Inc.
Aegis Aerospace
Aerocyonics, Inc.
AeroKinetic Systems LLC
Agni Semiconductor LLC.
Air Force Research Laboratory
Allendevaux & Company LLC
AI Sensation
Amazon
Amentum
Anaflash
Analog Devices
Apex Microdevices
Applied Optimization, Inc.
Applied Research Associates
Appogee Engineering
Arm
ARCTOS Technology Solutions, LLC
Argonne National Laboratory
ASMPT SMT USA, LLC
Aspinity
Astertech
Astrabeam
Atom Computing
Attollo Engineering LLC
Ausley Engineering, LLC
Autobots Technology LLC
Averatek Corporation
Avient
BAE Systems, Inc.
Baker and Associates, Inc.
Bascom Hunter Technologies
Battelle
BLT
Blue Phoenix Aerospace
Boeing Company
Boise State University
Booz Allen Hamilton
Bowling Green State University
Braxton Miller Foundation
Brisk Computing LLC
C-Star Solutions, LLC
Cactus Materials, Inc.
CAES
Calfee, Halter & Griswold LLP
Camenzind Solutions
CapV
Carbice Corporation
Carnegie Mellon University
CAS
Case Western Reserve University
Central State University
Cerebras
CFD Research Corporation
Chicago State University
Circuit Design Specialties
Clark State College
Collins Aerospace
Columbus State Community College
Community STEAM Academy-Xenia
Converge Technologies
Cornet Technology Inc
Cotsworks
CryoCooler Corporation
Cycuity, Inc.
D-Wave
Dayton Development Coalition
Dayton Photonics
DEI Directive
Darkhive Inc.
Diamond Foundry, Inc.
Dif Inc.
Disco Hi-Tec America
DPA Components International
Draper
Drexel University
DS Government Solutions
Duke University
DuPont Specialty Products USA, LLC
DUST Identity
Edaptive Computing, Inc
Efficient Computer Company
EHT Semi
EFABLESS CORPORATION
Electroninks
Element 6
ELEVAN LLC, DBA ELEVAN SYSTEMS
Engenius Micro
Engineered Products of Ohio
EPIR, Inc.
Epirus inc.
Ericsson
EWI
Fabublox, Inc.
Fermi National Accelerator Laboratory
Flex Logix Technologies, Inc.

Florida International University
FormFactor
Forster Tool & Manufacturing
fprime AI
Freedom Photonics, LLC
Frequency Electronics Inc.
Fresnel
Future Foundation North America Inc
GDSI
Geometric Data Analytics
GeoREC Center
George Mason University
Georgia Institute of Technology
GhostWave Inc
Gidha Consulting
GIRD Systems
GLC Technologies
GlobalFoundries
GlobalWafers
GLX Power Systems Inc.
Graf Research
Great Lakes Crystal Technologies
Great Plains Development Authority/Kansas Proving Grounds
Green Mountain Semiconductor
HamiltonDemo
Hawassa University
Hire Henry
Honeywell Aerospace-Space
Hour Precision
HPE
HRL Laboratories
Huntington Ingalls Industries (HII)
Idaho Scientific
IERUS Technologies
Illinois Institute of Technology
imec IC-Link U.S.A.
In2FAB Technology
Incyte Media
Indiana Microelectronics
Integrated Holdings, Inc. dba D & N Gage Inc.
Intel Corporation
Interdigital
Intus Technologies LLC
IonQ, Inc.
IQE, Inc.
Irvine Sensors
Johns Hopkins University
KBR
KCNSC (KansasCity National Security Campus)
Kent Displays, Inc
Keysight
Kryptowire
Kulicke & Soffa
L & L Plastics
L3Harris Technologies, Inc.
Lake Shore Cryotronics
Lattice Materials LLC
Lawrence Semiconductor Research Laboratory, Inc.
Leidos
Leonardo DRS
LeoGreenAI
Lockheed Martin
Lorain County Community College
Lumeova
LUX Semiconductors
Luxium Solutions, LLC
MACOM Technology Solutions, Inc.
Mantel Technologies
MarTek, Inc.
Marvell Government Solutions
Marvin Test Solutions
Matrix Research
Maury Microwave
McGregor and Associates
memQ Inc
Melanin MicroChips
Messer Construction
Metis Microsystems
Mettler Toledo
Miami University
Michigan State University
Microfabrication Solutions Inc.
MicroLink Devices Inc
Midgard Education Publishing, LLC
Modelithics
Modern Microsystems
Montana State University

Siemens Industry Software, Inc.
SiFive Inc.
Sigenics, Inc
Silicon Assurance
Silicon Operations Inc
Silicon Technologies, Inc.
Silvaco
Single Crystal Diamond
Sixline Semiconductor
SK Infrared
SkyWater Technology Foundry, Inc.
SMART Microsystems, Ltd
Snochip
Soundsside Partners LLC
Southwest Research Institute
Spark Photonics Design, Inc.
Spectral Energies, LLC
SRI
SRICO, Inc.
Staffco
StethX Microsystems Inc.
SUSS MicroTec Inc.
SWIR Vision Systems
Synopsys, Inc.
Tacan Information Systems
Tagore Technology
TAP Engineering
TECHForge Solutions
Teledyne FLIR Commercial Systems (aka Teledyne FLIR Components)
Tenet3
Tercero Technologies
Texas A&M University
TF Wireless
The Tipp Harrison Group LLC
Thinks Works, PBC
Tekscend Photomask Round Rock, Inc.
Tortuga Logic Inc., dba Cycuity
Tosoh SMD, Inc.
Tower Semiconductor
Trusted Semiconductor Solutions
UES Inc.
The Uhl Agency
UMASS
University of Akron
University of Arkansas
University of California San Diego
University of Central Florida
University of Cincinnati
University of Dayton
University of Florida
University of Illinois at Chicago
University of Kansas
University of Louisville
University of Maryland
University Of Michigan
University of Michigan, Ann Arbor
University of Minnesota – Twin Cities
University of Missouri-Kansas City
University of North Carolina at Charlotte
University of Notre Dame
University of Pennsylvania
University of Southern California
University of Tennessee, Knoxville
University of Texas Austin
University of Texas Dallas
University of Toledo
University of Utah
University of Wisconsin-Madison
Univertical
US Army Research Laboratory
US Naval Research Laboratory
Varioscale
Vertaeon
Vets To Drones
Vyir Inc
WD Advanced Materials
Wichita State University
WingXpand, INC
Wireless@VT
WiTest
Wize Owl, LLC
WNK Aviation LLC
Wolfspeed
Woolpert
Wright Brothers Institute
Wright State University
X-celeprint
Xcelerium
Youngstown State University