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Microelectronics: Powering the Digital Battlespace and Securing the
Long-Range Kill Chain

Microelectronics: Powering the Digital Battlespace and Securing the Long-Range Kill Chain

The future of national defense is fully digital, software-defined, and speed-driven. At the core of that future are trusted, high-performance microelectronics.  Last week, I spent a few days at the AFA Space Warfare Symposium to better understand warfighter, force design architect’s and military commanders’ needs, capability gaps and areas of concern.  To summarize it all, every sensor, platform, effector, and command node depends on semiconductors. From space-based sensing to autonomous systems operating at the edge, microelectronics determine whether our forces can detect, decide, and deliver effects before an adversary can respond. Below are some additional take-aways from last week’s event.

The Future is Software-Defined

Defense systems are rapidly evolving into software-defined products — adaptable, upgradeable, and mission-configurable in real time. This transformation demands chips designed not just for performance, but for cost efficiency, reduced size, weight, and power (SWaP), secure edge processing, and high-bandwidth, long-range data transmission.

In tomorrow’s fight, performance is measured not only in teraflops, but in how effectively a system balances capability with SWaP constraints across distributed operations.  When you think about it, our current military industrial base was built out of the 1980’s and 1990’s.  Now is the time to pivot and make things happen faster: Accelerate/Collaborate/Execute.  That is the value of the consortium model and the ability for us to move data at the speed of need.

Speed is Deterrence

If I had a nickle for every time I heard “speed” during the conference, it could have paid for my registration!  “Time” is now the decisive variable. The ability to close the long-range kill chain — detecting, identifying, targeting, and delivering effects across vast distances — is imperative to maintaining deterrence.  To achieve this, we must accelerate emulation and digital prototyping before fabrication to dramatically shorten design cycles.  Emulation before fabrication is no longer optional — it is critical to fielding trusted capability at speed.  We must reduce time from concept to operational capability by understanding the mission threads and capability gaps needed by our warfighters.  Imperative to every successful mission, we must integrate sensors, effectors, and command and control into resilient and redundant architectures that can take a punch and immediately get back up.

Every Mission is a Network

In the evolving battlespace, everything is a node. Satellites, aircraft, ships, unmanned systems, ground vehicles, and warfighters themselves must operate as part of a secure, connected digital ecosystem.  Each node must have the ability to process data at the edge, communicate over long ranges, adapt to dynamic threats and deliver fast, accurate responses. This requires flexible, software-defined sensors and sensor-processing architectures capable of evolving as adversaries adapt.

Building a Resilient Kill Chain

Deterrence depends on a kill chain that is not only lethal, but resilient and redundant. Sensors, effectors, and command and control systems must function seamlessly even in contested environments.  Operational superiority will be defined by our ability to sustain long-range targeting, protect data integrity, maintain connectivity under disruption and execute with precision and speed.  Microelectronics sit at the center of this architecture. Without secure, advanced semiconductors, the kill chain breaks.

The next generation of conflict will reward the nation that can move fastest — from design to deployment, from detection to decision, from time-to-target to mission effect. To ensure our military remains responsive to dynamic threats, we must invest in trusted domestic microelectronics, accelerate innovation cycles, and build a connected, digital defense ecosystem.  The future battlespace will be defined by speed, software, and silicon.  And leadership begins at the chip level…leadership begins at MMEC.

Apply Now for a new GaN MPW Access Program

HRL Laboratories, in partnership with CA DREAMS and MMEC, is offering GaN designers subsidized access to its advanced T3L GaN process through a prototype accelerator program.

Apply now to accelerate your innovation. Secure subsidized access to HRL’s proprietary T3L GaN process, CA DREAMS’ MOSIS 2.0 storefront, and MMEC’s DESIGN Platform to take your project from concept to high-performance prototype.

Why participate

Accelerate GaN prototyping

Access a state-of-the-art RF process

Strengthen U.S. design expertise

Bridge research to production

Key details

Application deadline: May 1, 2026

Tile fee: $10,000

U.S.-based applicants only

How to apply
Email: GaNMPW@hrl.com for application details and required forms
(NDA, T&Cs, EULA)

Timeline

Awards: June 5, 2026

Design submission: Sept 4, 2026

Die delivery: March 2027

Final report: April 2027